KnE Engineering

ISSN: 2518-6841

The latest conference proceedings on all fields of engineering.

Register for Content Alerts
Navigation

Optimization of Electronic Components Mounting Sequence for 3D MID Assembly Process

Journal Title: KnE Engineering

Issue title:

DOI: 10.18502/keg.v2i3.1111

Authors:

Kurnosenko A.E.akurn@bmstu.ruBauman Moscow State Technical University, ul. Baumanskaya 2-ya, 5, Moscow, 105005

Arabov D.I.Bauman Moscow State Technical University, ul. Baumanskaya 2-ya, 5, Moscow, 105005

Abstract:
This article considers the assembly technology of three-dimensional molded interconnect devices (3D MID). The problem of performance optimization for dispensing and component placement operations is explored. Optimization is assumed on the reduction of the auxiliary time of the dispensing/placement head and manipulator have to spend traveling through all component mounting positions. The problem is defined as the traveling salesman one. The article zeroed in distance/time matrix determination for dispensing/placement head and manipulator three-dimensional movements in the case of the selected kinematics diagram of the assembly equipment. Formulas for determination of this matrix are proposed, formal description of the optimization problem is presented, and a brief review of problem-solving methods is described.
References:

[1] Franke, J. 3D-MID: Three-Dimensional Molded Interconnect Devices. Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers // Hanser Publications. 2014.
[2] Kamyshnaya, E.N., Kurnosenko, A.E., Ivanov, J.V. System analysis of 3D MID technologies // Engineering magazine: Science and innovations – 2013. № 11 (23). – С. 15.
[3] HARTING Mitronics. Position sensor for adaptive speed control. URL: http://www.harting-mitronics.ch/fileadmin/hartingmitronics/case_studies/Position_sensor_for_adaptive_speed_control.pdf.
[4] Ali Fuat, Alkaya, Ekrem, Duman, Application of Sequence-Dependent Traveling Salesman Problem in Printed Circuit Board Assembly // IEEE transactions on components, packaging and manufacturing technology – Vol. 3, No. 6, June 2013 – PP. 1063-1076. DOI: 10.1109/TCPMT.2013.22524.
[5] Häcker Automation GmbH. 3-D Micro Assembly of Molded Interconnect Devices (3-D MID) // hybridica 2010 Forum, Munich, Germany, November 9th – 12th, 2010. URL: http://media.nmm.de/70/haeckerautomationgmbh_24445970.pdf.
[6] Pfeffer, M., Goth, C., Craiovan, D., Franke, J., 3D-Assembly of Molded Interconnect Devices with standard SMD pick & place machines using an active multi axis workpiece carrier // 2011 IEEE International Symposium on Assembly and Manufacturing (ISAM), 25-27 May 2011, DOI: 10.1109/ISAM.2011.5942362.
[7] Patent № 2006611924 Russian Federation. Software module for defining of optimal component placemen sequence on PCBs and computer aided program processing for automated assembly equipment (Module of computer aided program processing): certificate of software official registration / Ivanov J.V., Kurnosenko A.E.; applicants and rightholders: Ivanov J.V., Kurnosenko A.E. – № 2006611119; applied 11.04.2006; registered 02.06.2006.
[8] Yudin, A., Kolesnikov, M., Vlasov, A., Salmina, M., Project oriented approach in educational robotics: from robotic competition to practical appliance // Advances in Intelligent Systems and Computing. 2017. Т. 457. С. 83-94.
[9] Andreev, K.A., Vlasov, A.I., Shakhnov, V.A. Silicon pressure transmitters with overload protection // Automation and Remote Control. 2016. Т. 77. № 7. С. 1281-1285.

Download
Cite
Share